Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

0 0 11 months ago
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction

Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here: https://tinyurl.com/szx3xt8

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