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DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. Website: https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/
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DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. Website: https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/
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| Author | flipchipepoxy |
| Organization | flipchipepoxy |
| Categories | Technology |
| Website | - |
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